Effect of porogen residue on chemical, optical, and mechanical properties of CVD SiCOH low- k materials

Electrochemical and Solid-State Letters

Volumn 12, Issue 8, 2009, Pages

  Urbanowicz, Adam M ^a,b   Vanstreels, Kris ^a   Shamiryan, Denis ^a   De Gendt, Stefan ^a,b   Baklanov, Mikhail R ^a  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CONCENTRATION OF; DOWN-STREAM PLASMAS; K-MATRIX; LOW-K FILMS; LOW-K MATERIALS; MASS LOSS; POROGEN; POROUS LOW-K; RESIDUE REMOVAL; UV-CURING;

CURING; ELECTRIC CURRENTS; MECHANICAL PROPERTIES; PLASMA DEPOSITION; PLASMA DIAGNOSTICS; PLASMAS;

CHEMICAL VAPOR DEPOSITION;

EID: 67649204971     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3139741     Document Type: Article

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