Self-assembled organic thin films on electroplated copper for prevention of corrosion

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 22, Issue 4, 2004, Pages 1917-1925

  Tan, Y S ^a   Srinivasan, M P ^a   Pehkonen, S O ^a   Chooi, Simon Y M ^a,b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY (EIS); ELECTROPLATED COPPER; HETEROAROMATIC AZOLIC MOLECULES; ORGANIC THIN FILMS;

ADSORPTION; AROMATIC COMPOUNDS; COPPER; CORROSION INHIBITORS; CORROSION PREVENTION; ELECTROCHEMISTRY; ELECTROMIGRATION; ELECTROPLATED PRODUCTS; IMPURITIES; INTEGRATED CIRCUITS; OXIDATION; SELF ASSEMBLY; X RAY PHOTOELECTRON SPECTROSCOPY;

THIN FILMS;

EID: 4344717857     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1763901     Document Type: Conference Paper

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