Grain structure and crystallographic orientation in Cu damascene lines

Microelectronic Engineering

Volumn 71, Issue 2, 2004, Pages 182-189

  Ji, Yuan ^a   Zhong, Taoxing ^a   Li, Zhiguo ^a   Wang, Xiaodong ^a   Luo, Dong ^a   Xia, Yang ^b   Liu, Zhimin ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

^b INSTITUTE OF GEOLOGY AND GEOPHYSICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; ATOMIC FORCE MICROSCOPY; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; CRYSTALLOGRAPHY; DIFFUSION; ELECTROMIGRATION; GRAIN GROWTH; METALLIC FILMS; METALLIZING; NUCLEATION; TEXTURES; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

DAMASCENE LINES; ORIENTATION DISTRIBUTION FUNCTIONS (ODF);

COPPER COMPOUNDS;

EID: 0347601890     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2003.11.002     Document Type: Article

References (17)

1. Jackson R.L., Broadbent E., Cacouris T., Harrus A. Solid State Technol. 49:1998;49-59.
2. P.R. Besser, A. Marathe, L. Zhao, M. Herrick, C. Capasso, H. Kawasaki, Optimizing the electromigration performance of copper lines, in: Technical Digest International Electron Devices Meeting, 2000, pp. 119-121.
3. Agarwala B.N., Patnaik B., Schnitzel R. Appl. Phys. Lett. 43(4):1972;1487-1493.
4. Knorr D.B., Rodbell K.P. Submicrometer Metal. 1805:1992;210-221.
5. Vaidya S., Sinha A.K. Thin Solid Film. 75:1981;253-259.
6. Besser P.R., Sanchez J.E. Jr., Field D. Advanced Metallization for ULSI Applications. 1997;Materials Research Society, Warrendale, PA. p. 89.
7. Nucci J.A., Keller R.R., Sanchez J.E. Jr. Appl. Phys. Lett. 69(26):1996;4017-4019.
8. Bunge H.J. Texture Analysis in Material Science. 1982;Butterworths, London.
9. Dingley D.J., Randle V. J. Mater. Sci. 27:1992;4545-4566.
10. Lingk C., Gross M.E., Brown W.L. J. Appl. Phys. 87(5):2000;2232-2236.
11. Field D.P., Sanchez J.E., Besser P.R., Dingley D.J. J. Appl. Phys. 82(5):1997;2383-2392.
12. A. Huot, A.H. Fischer, A. von Glasow, R.A. Schwarzer, in: O. Kraft, E. Arzt, C.A. Volkert, P.S. Ho, H. Okabayashi (Eds.), Stress Induced Phenomena in Metallization. AIP Conf. Proc. 491 (1999) 261-264.
13. Riege S.P., Thompson C.V. Scripta Mater. 41(4):1999;403-408.
14. Attardo M.J., Rosenburg R. Appl. Phys. Lett. 41(6):1970;2381-2386.
15. Knorr D.B., Tracy D.P., Rodbell K.P. Appl. Phys. Lett. 59(25):1991;3241-3243.
16. Vanasupa L., Joo Y.C., Besser P.R., Pramanick S. J. Appl. Phys. 85(5):1999;2583-2590.
17. Gladkikh A., Karpovski M., Palvski A., Kaganovskii Y. J. Phys. D. 31:1998;1626-1629.