Characteristics of ion beam deposited copper thin films as a seed layer: Effect of negative substrate bias voltage

Thin Solid Films

Volumn 434, Issue 1-2, 2003, Pages 34-39

  Lim, J W ^a   Miyake, K ^b   Isshiki, M ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b SAITAMA UNIVERSITY   (Japan)

Author keywords

Copper; Ion bombardment; Resistivity; Seed layer

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; ION BEAM ASSISTED DEPOSITION; ION BOMBARDMENT; SCANNING ELECTRON MICROSCOPY; SECONDARY ION MASS SPECTROMETRY; TEXTURES; X RAY DIFFRACTION ANALYSIS;

BIAS VOLTAGE;

THIN FILMS;

EID: 0037601749     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)00540-6     Document Type: Article

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