Predictive analytical thermal stress modeling in electronics and photonics

Applied Mechanics Reviews

Volumn 62, Issue 4, 2009, Pages 1-20

  Suhir, E ^a,b,c,d  

^a LUCENT TECHNOLOGIES   (United States)

^b University of California Santa Cruz   (United States)

^c UNIVERSITY OF MARYLAND   (United States)

^d ERS CO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATED LIFE TESTING; ADHERENDS; ANALYTICAL MODELING; BI-MATERIAL; BONDING LAYERS; COATED OPTICAL FIBERS; COMPUTER AIDED SIMULATIONS; DESIGN RECOMMENDATIONS; EXPERIMENTAL TECHNIQUES; FINITE ELEMENT ANALYSIS; FINITE SIZE; HIGH-TECHNOLOGY; INDUCED STRESS; INTEGRATED CIRCUIT DEVICES; INTERFACIAL STRESS; LOW-MODULUS; MECHANICAL BEHAVIOR; NANO-MATERIALS; OPTO-ELECTRONICS; PACKAGING ASSEMBLIES; PHOTONIC ASSEMBLY; PHOTONIC ENGINEERING; PHOTONIC STRUCTURE; PHYSICAL DESIGN; PLASTIC PACKAGES; PRACTICAL MODEL; PROBABILISTIC METHODS; RELIABILITY EVALUATION; SOLDER JOINTS; SOLDERED ASSEMBLY; STRUCTURAL ELEMENTS; THERMAL LOADINGS; THIN FILM SYSTEMS;

COMPUTER SIMULATION; COMPUTER TESTING; ELASTICITY; FINITE ELEMENT METHOD; MODELS; OPTICAL FIBERS; PACKAGING; PHOTONIC DEVICES; TESTING; THERMAL EXPANSION; THERMAL LOAD; THERMAL STRESS; THERMOELASTICITY;

STRUCTURAL DESIGN;

COMPUTERS; ELASTICITY; FIBERS; MODELS; PACKAGING; SIMULATION; STRUCTURAL DESIGN; TESTING; THERMAL EXPANSION; THERMAL PROPERTIES; THERMAL STRESS;

EID: 72149115809     PISSN: 00036900     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.3077136     Document Type: Review

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141. Noor, A. K., and Malik, M., 2000, "An Assessment of Five Modelling Approaches for Thermo-Mechanical Stress Analysis of Laminated Composite Panels," Comput. Mech., 25, pp. 43-58.
142. Suhir, E., 1989, "Applications of an Epoxy Cap in a Flip-Chip Package Design," ASME J. Electron. Packag., 111(1), pp. 233-255.
143. van Doorselaer, K., and deZeeuw, K., 1990, "Relation Between Delamination and Temperature Cycling Induced Failures in Plastic Package Devices," 40th ECTC.
144. Pendse, R., and Demmin, J., 1990, "Test Structures and Finite Element Models for Chip Stress and Plastic Package Reliability," IEEE Conference on Microelectronic Test Structures, San Diego.
145. Ganssan, G. S., and Berg, H., 1993, "Model and Analysis for Reflow Cracking Phenomenon in SMT Plastic Packages," 43rd IEEE ECTC.
146. Suhir, E., and Ilyas, Q. S. M., 1996, "" Thick" Plastic Packages With "Small" Chips vs "Thin" Packages With "Large" Chips: How Different Is Their Propensity to Moisture Induced Failures?," Structural Analysis in Microelectronics and Fiber Optics Symposium Proceedings, E. Suhir, ed., ASME, New York.
147. Uschitsky, M., and Suhir, E., 1996, "Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner," Structural Analysis in Microelectronics and Fiber Optics Symposium Proceedings, E. Suhir, ed., ASME, New York.
148. Suhir, E., 1997, "Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application of von-Karman Equations With Consideration of Thermoelastic Strains," Int. J. Solids Struct., 34(12), pp. 2991-3019.
149. Shin, D. K., and Lee, J. J., 1997, "A Study on the Mechanical Behavior of Epoxy Molding Compound and Thermal Stress Analysis in Plastic Packaging," Advances in Electronic Packaging 1997, E. Suhir et al., eds., ASME, New York, Vol. 1.
150. Ushitsky, M., Suhir, E., and Kammlott, G. W., 2001, "Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach," ASME J. Electron. Packag., 123(4), pp. 27-31.
151. Kirk, J. J., Tor, J. L., Guven, J. L., Madenci, I., Mertol, E., and Kutke, A., 2004, "Experimental Validation of Hydro/Thermo-Mechanical Simulations for Multi-Material Polymer Structures," 54th ECTC.
152. Slattery, O., Hayes, T., Lawton, W., Kelly, G., Lyden, C., Barrett, J., and O'Mathuna, C., 1995, "Methods of Analysing Thermomechanical Stress in Plastic Packages for Integrated Circuits," J. Mater. Process. Technol., 54(1-4), pp. 199-204.
153. Shin, D. K., and Lee, J. J., 1998, "Effective Material Properties and Thermal Stress Analysis of Epoxy Molding Compound in Electronic Packaging," IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 21(4), pp. 1-8.
154. Suhir, E., 1993, "Predicted Bow of Plastic Packages of Integrated Circuit Devices," Thermal Stress and Strain in Microelectronic Packaging, J. H. Lau, ed., Van Nostrand Reinhold, New York.
155. Suhir, E., and Weld, J., 1997, "Electronic Package With Reduced Bending Stress," U.S. Patent No. 5,627,407.
156. Suhir, E., 2001, "Arrangement for Reducing Bending Stress in an Electronics Package," U.S. Patent No. 6,180,241.
157. Suhir, E., 2001, "Device and Method of Controlling the Bowing of a Soldered or Adhesively Bonded Assembly," U.S. Patent No. 6,239,382.
158. Suhir, E., 2003, "Bow Free Adhesively Bonded Assemblies: Predicted Stresses," Electrotechnik & Informationtechnik, 120(6), pp. B12/1-B12/4.
159. Suhir, E., 2004, "Bow-Free Assemblies: Predicted Stresses," Therminic' 2004, Nice, France, Sept. 29-Oct. 1.
160. Suhir, E., 1988, "Stresses in Dual-Coated Optical Fibers," ASME J. Appl. Mech., 55(10), pp. 1169-1171.
161. Suhir, E., 1998, "Fiber Optic Structural Mechanics: Brief Review," ASME J. Electron. Packag., 120(3), pp. 217-220.
162. Suhir, E., 2003, "Polymer Coated Optical Glass Fibers: Review and Extension," Proceedings of the POLYTRONIK'2003, Montreaux, Oct. 21-24.
163. Bubel, G. M., Krause, J. T., Bickta, B. J., and Kee, R. T., 1989, "Mechanical Reliability of Metallized Optical Fiber for Hermetic Terminations," J. Lightwave Technol., 7(10), pp. 1488-1493.
164. Suhir, E., 1990, "Mechanical Approach to the Evaluation of the Low Temperature Threshold of Added Transmission Losses in Single-Coated Optical Fibers," J. Lightwave Technol., 8(6), pp. 863-868.
165. Shiue, S. T., 1994, "Thermal Stresses in Tightly Jacketed Double-Coated Optical Fibers at Low Temperature," J. Appl. Phys., 76(12), pp. 7695-7703.
166. Suhir, E., and Vuillamin, J. J., Jr., 2000, "Effects of the CTE and Young's Modulus Lateral Gradients on the Bowing of an Optical Fiber: Analytical and Finite Element Modeling," Opt. Eng. (Bellingham), 39(12), pp. 749-757.
167. Muraoka, M., 2001, "The Maximum Stress in Optical Glass Fibers Under Two-Point Bending," ASME J. Electron. Packag., 123, pp. 70-73.
168. Suhir, E., 2002, "Apparatus and Method for Thermostatic Compensation of Temperature Sensitive Devices," U.S. Patent No. 6,337,932.
169. Suhir, E., 2003, "Optical Fiber Interconnects Having Offset Ends With Reduced Tensile Strength and Fabrication Method," U.S. Patent No. 6,606,434.
170. Gebizioglu, O. S., and Plitz, I. M., 1991, "Self-Stripping of Optical Fiber Coatings in Hydrocarbon Liquids and Cable Filling Compounds," Opt. Eng. (Bellingham), 30(6), pp. 749-762.
171. Riddle, R. A., 1991, "Prediction of Damage in Optical Coatings Due to Thermal Stresses Caused by the Bulk Absorption of X-Rays," J. Therm. Stresses, 14, pp. 319-334.
172. Devadoss, E., 1992, "Polymers for Optical Fiber Communication Systems," J. Sci. Ind. Res., 51(4), pp. 4109-4112.
173. Shiue, S. T., 1994, "The Hydrostatic Pressure Induced Stresses in Double-Coated Optical Fibers," Journal of the Chinese Institute of Engineers, 17(4), pp. D31-35.
174. Shiue, S. T., and Lee, W. H., 1997, "Thermal Stresses in Carbon Coated Optical Fibers at Low Temperature," J. Mater. Res., 12(9), pp. 2493-2498.
175. King, W. W., and Aloisio, C. J., 1997, "Thermomechanical Mechanism for Delamination of Polymer Coatings From Optical Fibers," ASME J. Electron. Packag., 119(2), pp. 133-137.
176. Suhir, E., 1988, "Effect of Initial Curvature on Low Temperature Microbending in Optical Fibers," J. Lightwave Technol., 6(8), pp. 1321-1327.
177. Suhir, E., 1988, "Spring Constant in the Buckling of Dual-Coated Optical Fibers," J. Lightwave Technol., 6(7), pp. 1240-1244.
178. Shiue, S. T., and Lee, S. B., 1992, "Thermal Stresses in Double-Coated Optical Fibers at Low Temperature," J. Appl. Phys., 72(1), pp. 18-23.
179. Shiue, S. T., 1992, "Design of Double-Coated Optical Fibers to Minimize Hydrostatic-Pressure-Induced Microbending Losses," IEEE Photonics Technol. Lett., 4(7), pp. 746-748.
180. Cocchini, F., 1994, "Double-Coated Optical Fibers Undergoing Temperature Variations: The Influence of the Mechanical Behavior on the Added Transmission Losses," Polym. Eng. Sci., 34(5), pp. 414-419.
181. Shiue, S. T., 1994, "Thermally Induced Microbending Losses in Double-Coated Optical Fibers at Low Temperature," Mater. Chem. Phys., 38(2), pp. 187-190.
182. Shiue, S. T., 1997, "The Spring Constant in the Buckling of Tightly Jacketed Double-Coated Optical Fibers," J. Appl. Phys., 81(8), pp. 3363-3368.
183. Suhir, E., 1998, "Coated Optical Fiber Interconnect Subjected to the Ends Off-Set and Axial Loading," International Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, Nov. 29-Dec. 2, ASME, New York.
184. Suhir, E., 2000, "Optical Fiber Interconnect With the Ends Offset and Axial Loading: What Could Be Done to Reduce the Tensile Stress in the Fiber?," J. Appl. Phys., 88(7), pp. 3865-3871.
185. Suhir, E., 1998, "Critical Strain and Postbuckling Stress in Polymer Coated Optical Fiber Interconnect: What Could Be Gained by Using Thicker Coating?," International Workshop on Reliability of Polymeric Materials and Plastic Packages of IC Devices, Paris, Nov. 29-Dec. 2, ASME, New York.
186. Shiue, S. T., 1994, "The Axial Strain-Induced Stresses in Double-Coated Optical Fibers," Journal of the Chinese Institute of Engineers, 17(1), pp. 727-729.
187. Kim, K. J., and Bar-Cohen, A., 2003, "Thermo-Optical Behavior of Passively-Cooled Polymer Waveguides," Proceedings of the ASME IMECE Conference, Washington, DC, Nov.
188. Kim, K. J., Bar-Cohen, A., and Han, B. T., 2004, "Thermo-Optical Characteristics of Bragg Grating Polymer Waveguides," First International Symposium on Micro and Nano Technology, Honolulu, HI, Mar.
189. Suhir, E., 2007, "Elastic Stability of a Dual-Coated Optical Fiber of Finite Length," J. Appl. Phys., 102(4), p. 043107.
190. Suhir, E., 2007, "Elastic Stability of a Dual-Coated Optical Fiber With a Stripped Off Coating at Its End," J. Appl. Phys., 102(3), p. 033109.
191. Suhir, E., 1993, "Predicted Stresses and Strains in Fused Biconical Taper Couplers Subjected to Tension," Appl. Opt., 32(18), pp. 3237-3240.
192. Liu, X., and Lu, B. K., 2004, "Comparison Between Epi-Down and Epi-Up Bonded High-Power Single-Mode 980-nm Semiconductor Lasers," IEEE Trans. Adv. Packag., 27(4), pp. pp. 640-646.
193. Liu, X., Wang, J., and Wei, P., 2008, "Study of the Mechanisms of Spectral Broadening in High Power Semiconductor Laser Arrays, ECTC.
194. Suhir, E., 1997, Applied Probability for Engineers and Scientists, McGraw-Hill, New York.
195. Suhir, E., 1997, "Probabilistic Approach to Evaluate Improvements in the Reliability of Chip-Substrate (Chip-Card) Assembly," IEEE CPMT Transactions, Part A, 20(1), pp. 60-63.
196. Suhir, E., 2000, "Thermal Stress Modeling in Microelectronics and Photonics Packaging, and the Application of the Probabilistic Approach: Review and Extension," Int. J. Microcircuits Electron. Packag., 23(2), pp. 215-223.
197. Suhir, E., 2004, "Polymer Coated Optical Glass Fiber Reliability: Could Nano-Technology Make a Difference?," Polytronic'04, Portland, OR, pp. 13-15.
198. Lee, S. C., Dawson, L. R., Pattada, B., Brueck, S. R. J., Jiang, Y.-B., and Xu, H., 2004, "Strain-Relieved, Dislocation-Free InxGa1-xAs/GaAsHetero-Structure by Nanoscale-Patterned Growth ," Appl. Phys. Lett., 85(18), pp. 4181-4183.
199. Suhir, E., 2005, "New Nano-Particle Material (NPM) for Micro- and Opto-Electronic Packaging Applications," IEEE Workshop on Advanced Packaging Materials, Irvine, CA, Mar.
200. Suhir, E., and Ingman, D., 2006, "Highly Compliant Bonding Material and Structure for Micro- and Opto-Electronic Applications," ECTC'06 Proceedings, San Diego, May.
201. Ingman, D., and Suhir, E., 2007, "Optical Fiber With Nano-Particle Overclad," U.S. Patent No. 7,162,138.
202. Ingman, D., and Suhir, E., 2007, "Optical Fiber With Nano-Particle Cladding," U.S. Patent No. 7,162,137.
203. Suhir, E., 2007, "Apparatus and Test Device for the Application and Measurement of Prescribed, Predicted and Controlled Contact Pressure on Wires," U.S. Patent No. 7,279,916.
204. Suhir, E., 2007, "Fiber-Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension," Microand Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability, E. Suhir, C. P. Wong, and Y. C. Lee, eds., Springer, New York.
205. Suhir, E., and Ingman, D., 2007, "Highly Compliant Bonding Material and Structure for Micro- and Opto-Electronic Applications," Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability, E. Suhir, C. P. Wong, and Y. C. Lee, eds., Springer, New York.
206. Mirer, T., Ingman, D., and Suhir, E., 2007, "Reliability Improvement Through Nano-Particle-Material-Based Fiber Structures," Opt. Fiber Technol., 13, pp. 27-31.
207. Suhir, E., 2007, "Polymeric Coating of Optical Silica Fibers, and a Nanomaterial-Based Coating System," Keynote Presentation, Polytronic' 2007, Proceedings of the International Conference on Polymeric Materials for Micro- and Opto-Electronics Applications, Tokyo, Japan, Jan. 14-16.
208. Xu, Y., Zhang, Y., Suhir, E., and Wang, X., 2006, "Thermal Properties of Carbon Nanotube Array for Integrated Circuits Cooling," J. Appl. Phys., 100, p. 074302.
209. Zhang, Y., Xu, Y., and Suhir, E., 2006, "Effect of Rapid Thermal Annealing (RTA) on Thermal Properties of Carbon Nanofibre (CNF) Arrays," J. Phys. D, 39, p. 4878.
210. Zhang, Y., Xu, Y., and Suhir, E., 2006, "Effective Young's Modulus of Carbon Nanofiber Array," J. Mater. Res., 21(11), p. 2922.
211. Zhang, Y., Suhir, E., Xu, Y., and Gu, C., 2006, "Bonding Strength of Carbon Nanofiber Array to Its Substrate," J. Mater. Res., 21(11), pp. 230-232.
212. Zhang, Y., Xu, Y., Gu, C., and Suhir, E., 2006, "Predicted Shear-Off Stress in Bonded Assemblies: Review and Extension," ASTR 2006, San Francisco, CA.
213. Zhang, Y., Xu, Y., Suhir, E., Gu, C., and Liu, X., 2008, "Compliance Properties Study of Carbon Nanofiber (CNF) Array as Thermal Interface Materials," J. Phys. D, 41, p. 155105.
214. Ingman, D., Ogenko, V., Suhir, E., and Glista, A., 2008, "Moisture Resistant Nano-Particle Material and Its Applications," U.S. Patent No. 7,321,714.
215. Zhang, Y., Suhir, E., and Gu, C., "Carbon Nanotubes/Nanofibers as Thermal Interface Materials (TIMs): Physical/Mechanical Properties and Requirements," Invited Review Paper, Taiwan, to be published.