Shock and thermal cycling synergism effects on reliability of CBGA assemblies

IEEE Aerospace Conference Proceedings

Volumn 5, Issue , 2000, Pages 327-333

  Ghaffarian, R ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER SIMULATION; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT TESTING; LAUNCHING; RELIABILITY; SHOCK WAVES; SPACECRAFT; STRAIN; STRESSES; THERMAL CYCLING;

CERAMIC BALL GRID ARRAYS; DROP TEST; MANUFACTURING DEFECTS; THERMAL RANDOM VIBRATION;

INTEGRATED CIRCUITS;

EID: 0034431640     PISSN: 1095323X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Ball grid array packaging guidelines
2. Shock and vibration limits for CBGA and CCGA