Predicted Thermally Induced Stresses in an Epoxy Molding Compound at the Chip Corner

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 1996-AE, Issue , 1996, Pages 67-100

  Uschitsky, M ^a   Suhir, E ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; DELAMINATION; DUCTILE FRACTURE; FRACTURE MECHANICS; MOLDING;

DELAMINATION LENGTH; EPOXY MOLDING COMPOUNDS; FILLET RADIUS; INDUCED STRESS; INTERFACIAL DELAMINATION; MECHANICAL RELIABILITY; PLASTIC PACKAGES; RADII OF CURVATURE; STRESS LEVELS; THERMALLY INDUCED STRESS;

CRACKS;

EID: 0141504545     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE1996-0724     Document Type: Conference Paper

References (7)

1. Bogy, D. B., 1971, Two Edge-Bonded Elastic Wedges of Different Materials and Wedge Angles under Surface Traction, ASME Journal of Applied Mechanics, Vol., pp. 377-386.
2. Nowacki, W., 1962, Thermoelasticity, Pergamon Press, Oxford University Press.
3. Parton, V. Z., Morozov, E. M., 1974, Mechanics of Elasto-Plastic Fracture, Mir, Moscow.
4. Rice, J. R., 1988, Elastic Fracture Mechanics Concepts for Interfacial Cracks, ASME Journal of Applied Mechanics, Vol. 55, pp. 98-103.
5. Timoshenko, S. P., Goodier, J. N., 1970, Theory of Elasticity, McGraw-Hill, New York.
6. Van Vroonhoven, J. C. W., 1993, Effects of Adhesion and Delamination on the Stress Singularities in Plastic-Packaged Integrated Circuits, ASME Journal of Electronic Packaging, Vol. 115, pp. 28-33.
7. Williams, M. L., 1952, Stress Singularities Resulting From Various Boundary Conditions in Angular Corners of Plates in Extension, ASME Journal of Applied Mechanics, pp. 526-530.