Parametric dependence of fatigue of electronic adhesives

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 2, 1999, Pages 200-208

  Gladkov, Alex ^a   Bar Cohen, Avram ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ALUMINUM; EPOXY RESINS; FATIGUE OF MATERIALS; SHEAR STRESS; SILICON; STRENGTH OF MATERIALS; THERMAL EXPANSION;

DIFFERENTIAL THERMAL EXPANSION;

ELECTRONICS PACKAGING;

EID: 0033310553     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.774732     Document Type: Article

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