Practical die stress model and its applications in flip-chip packages

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2000, Pages 393-399

  Guo, Yifan ^a   Zhao, Jie Hua ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); COMPUTER SIMULATION; COOLING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; RELIABILITY; SOLDERED JOINTS; THERMAL STRESS;

BENDING STRESS; BI-MATERIAL PLATE MODEL; DIE CURVATURE; FLIP CHIP PACKAGES;

ELECTRONICS PACKAGING;

EID: 0033694040     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (10)