Adhesively bonded assemblies with identical nondeformable adherends: Modeling of the induced thermal stresses in the adhesive layer

Composite Interfaces

Volumn 6, Issue 2, 1999, Pages 135-154

  Suhir, E ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

Adhesively bonded joints; Electronic photonic packaging; Identical adherends; Thermal stresses

Indexed keywords

BOND STRENGTH (MATERIALS); MATHEMATICAL MODELS; STRESS ANALYSIS; THERMAL EXPANSION; THERMAL STRESS; THERMOELASTICITY;

ADHESIVE BONDING; ADHESIVE LAYERS; IDENTICAL NONDEFORMABLE ADHERENDS;

ADHESIVE JOINTS;

EID: 0032676636     PISSN: 09276440     EISSN: None     Source Type: Journal    
DOI: 10.1163/156855499x00350     Document Type: Article

References (7)

1. E. Suhir, Stresses in bi-metal thermostats, ASME J. Appl. Mech. 53 (1986).
2. E. Suhir, Interfacial stresses in bi-metal thermostats, ASME J. Appl. Mech. 56 (1989).
3. c superconductive ceramics, Intern. J. Solids Struct. 27 (1991).
4. E. Suhir, Approximate evaluation of the elastic thermal stresses in a thin film fabricated on a very thick circular substrate, ASME J. Electr. Pack. 116 (1994).
5. A. E. H. Love, A Treatise on the Theory of Elasticity. Dover, New York (1944).
6. I. N. Sneddon, Special Function of Mathematical Physics and Chemistry. Oliver and Boyd, Edinburgh (1956).
7. G. N. Watson, A Treatise of the Theory of Bassel Functions, 2nd ed. Cambridge Univ. Press, Cambridge (1952).