Accelerated temperature cycle test and Coffin-Manson model for electronic packaging

Proceedings - Annual Reliability and Maintainability Symposium

Volumn , Issue , 2005, Pages 556-560

  Cui, Helen ^a,b,c  

^a RF Micro Devices ^*  (United States)

^b RF MICRO DEVICES   (United States)

^c Reliability and Failure Analysis Lab   (United States)

Author keywords

Accelerated Reliability Testing; Activation Energy; Coffin Manson Model; Temperature Cycle

Indexed keywords

COFFIN-MANSON MODELS; FAILURE MODES; TEMPERATURE CYCLE; ACCELERATED RELIABILITY TESTING; COFFIN-MANSON MODEL;

ELECTRONICS ENGINEERING; MATHEMATICAL MODELS; THERMAL CYCLING; WEIBULL DISTRIBUTION; ACTIVATION ENERGY; FAILURE ANALYSIS; RELIABILITY; STRESS ANALYSIS;

ELECTRONICS PACKAGING; ELECTRONIC EQUIPMENT;

EID: 27744504368     PISSN: 0149144X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

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2. Wiebull++™ 6, ReliaSoft Corporation, Tuson, AZ, 2002.
3. st Annual International Reliability Physics Symposium, 2003
4. Engineering Statistic Handbook, www.itl.nist.gov
5. Agarwal, R., Tuchscherer, L., Cui, H., "Thermal Cycling and Thermal Shock for FCOB (FCOB - Flip Chip On Board) Testing", ASME Interpack Conference, 1999