Subinterfacial cracks in bimaterial systems subjected to mechanical and thermal loading

Engineering Fracture Mechanics

Volumn 68, Issue 9, 2001, Pages 1081-1094

  Bae, Joon Soo ^a   Krishnaswamy, Sridhar ^a  

^a Northwestern University   (United States)

Author keywords

Coherent shearing interferometer; Finite element method; Stress intensity factor; Subinterfacial crack; Thermal stress

Indexed keywords

ALUMINUM; CRACK PROPAGATION; DISSIMILAR MATERIALS; INTERFACES (MATERIALS); INTERFEROMETRY; POLYMETHYL METHACRYLATES; STRESS INTENSITY FACTORS; THERMAL EFFECTS;

BIMATERIAL SYSTEMS; SUBINTERFACIAL CRACKS; THERMAL MISMATCHES;

FRACTURE MECHANICS;

CRACK INITIATION; CRACK PROPAGATION; FINITE ELEMENT METHOD; STRESS INTENSITY FACTOR; TEMPERATURE EFFECT; THERMAL CRACKING;

EID: 0035366203     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-7944(01)00005-4     Document Type: Article

References (9)

1. The behavior of subinterface cracks with crack-face contact
2. Crack growth induced by thermal-mechanical loading
3. Experimental investigation of interfacial fracture parameters and crack initiation under mechanical and thermomechanical loading
4. Theoretical and experimental analysis of semi-elliptical surface cracks subject to thermal shock
5. Compact polariscope/shearing-interferometer for mapping stress fields in bimaterial system
6. Optical mapping of crack tip deformations using the methods of transmission and reflection conherent gradient sensing: A study of crack tip K-dominance
7. General crack-tip fields for stationary and steadily growing interface cracks in anisotropic bimaterials
8. On the crack extension in plates under plane loading and transverse shear