Analysis of interfacial thermal stresses in a trimaterial assembly

Journal of Applied Physics

Volumn 89, Issue 7, 2001, Pages 3685-3694

  Suhir, E ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035307597     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1350623     Document Type: Article

References (21)

1. E. Suhir, Future Circuits 5 (1999).
2. S. P. Timoshenko, J. Opt. Soc. Am. 11 (1925).
3. O. Völkersen, Luftfahrtforschung 15 (1938) (in German).
4. B. J. Aleck, ASME J. Appl. Mech. 16 (1949).
5. W. T. Chen and C. W. Nelson, IBM J. Res. Dev. 23 (1979).
6. F.-V. Chang, Applied Mathematics and Mechanics (Tsing-hua University Press, Beijing, China, 1983), Vol. 4, No. 3.
7. E. Suhir, ASME J. Appl. Mech. 55 (1986).
8. P. M. Hall et al., ASME J. Electron. Packag. 112 (1990).
9. J. H. Lau, ASME J. Electron. Packag. 114 (1992).
10. R. Zeyfang, Solid-State Electron. 14 (1971).
11. J. W. Eischen et al., ASME J. Electron. Packag. 112 (1990).
12. A. Y. Kuo, ASME J. Appl. Mech. 57 (1990).
13. S. E. Yamada, ASME J. Electron. Packag. 114 (1992).
14. E. Suhir, ASME J. Electron. Packag. 121 (2000).
15. E. Suhir, ASME J. Appl. Mech. 56 (1989).
16. S. P. Timoshenko and S. Woinowsky-Krieger, Theory of Plates and Shells, 2nd ed. (McGraw-Hill, New York, 1959).
17. E. Suhir, Structural Analysis in Microelectronic and Fiber Optic Systems (Van Nostrand Reinhold, New York, 1991).
18. E. Suhir, Int. J. Solids Struct. 27 (1991).
19. V. Mishkevich and E. Suhir, Int. J. Microelectron Packaging 1 (1998).
20. E. Suhir, Compos. Interfaces 6 (1999).
21. E. Suhir, Int. J. Solids Struct. 37 (2000).