Bimaterial assembly with a low modulus bonding layer at the ends

Journal of Applied Physics

Volumn 93, Issue 6, 2003, Pages 3657-3661

  Suhir, E ^a,b  

^a UNIVERSITY OF ILLINOIS AT CHICAGO   (United States)

^b ERS CO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ELASTIC MODULI; ELASTICITY; OPTOELECTRONIC DEVICES; SHEAR STRESS; SOLDERING; STRENGTH OF MATERIALS;

BIMATERIAL ASSEMBLY;

MATERIALS SCIENCE;

EID: 0037444849     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1555254     Document Type: Article

References (6)

1. S. Strinivas, NASA Technical Note No. D-7855 (1975).
2. E. Suhir, in Advances in Thermal Modeling of Electronic Components and Systems, edited by A. Bar-Cohen and A. D. Kraus (Hemisphere, 1988).
3. S. Iwade, U.S. Patent No. 4,903,118 (filed 1988).
4. E. Suhir, J. Mater. Res. 16, 2996 (2001).
5. E. Suhir, SPIE 7th Annual International Symposium on Nondestructive Evaluations, 17-21 March 2002, San Diego, CA.
6. E. Suhir, J. Appl. Mech. 53 (1986).