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Volumn 21, Issue 11, 2006, Pages 2922-2926

Bonding strength of a carbon nanofiber array to its substrate

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE (MECHANICAL); INTERFACES (MATERIALS); MATERIALS TESTING; MATHEMATICAL MODELS; NANOSTRUCTURED MATERIALS; SHEAR STRESS; SHEARING; SUBSTRATES;

EID: 33751412596     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2006.0357     Document Type: Article
Times cited : (10)

References (13)
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  • 2
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    • Thermal interface properties of Cu-filled vertical aligned carbon nanofiber arrays
    • Q. Ngo, B.A. Cruden, A.M. Cassell, G. Sims, M. Meyyappan, J. Li, and C.Y. Yang: Thermal interface properties of Cu-filled vertical aligned carbon nanofiber arrays. Nano Lett. 4, 2403 (2004).
    • (2004) Nano Lett. , vol.4 , pp. 2403
    • Ngo, Q.1    Cruden, B.A.2    Cassell, A.M.3    Sims, G.4    Meyyappan, M.5    Li, J.6    Yang, C.Y.7
  • 3
    • 33645276531 scopus 로고    scopus 로고
    • Enhancement of thermal interface materials with carbon nanotube arrays
    • J. Xu and T.S. Fisher: Enhancement of thermal interface materials with carbon nanotube arrays. Int. J. Heat Mass Transfer 49, 1658 (2006).
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    • Xu, J.1    Fisher, T.S.2
  • 4
    • 20444457028 scopus 로고    scopus 로고
    • Noncontact thermal characterization of multiwall carbon nanotubes
    • X.W. Wang, Z. Zhong, and J. Xu: Noncontact thermal characterization of multiwall carbon nanotubes. J. Appl. Phys. 97, 064302 (2005).
    • (2005) J. Appl. Phys. , vol.97 , pp. 064302
    • Wang, X.W.1    Zhong, Z.2    Xu, J.3
  • 5
    • 33751424712 scopus 로고    scopus 로고
    • Thermal properties characterization of vertically aligned carbon nanotubes array used for IC cooling
    • Y. Xu, Y. Zhang, and X.W. Wang: Thermal properties characterization of vertically aligned carbon nanotubes array used for IC cooling. J. Appl. Phys. (2006).
    • (2006) J. Appl. Phys.
    • Xu, Y.1    Zhang, Y.2    Wang, X.W.3
  • 8
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    • Interfacial stresses in bi-metal thermostats
    • E. Suhir: Interfacial stresses in bi-metal thermostats. ASME J. Appl. Mechan. 56, 595 (1989).
    • (1989) ASME J. Appl. Mechan. , vol.56 , pp. 595
    • Suhir, E.1
  • 9
    • 0005016653 scopus 로고    scopus 로고
    • Thermomechanical stress modeling in microelectronics and photonics
    • E. Suhir: Thermomechanical stress modeling in microelectronics and photonics. Electronic Cooling 7, 4 (2001).
    • (2001) Electronic Cooling , vol.7 , pp. 4
    • Suhir, E.1
  • 10
    • 0037444849 scopus 로고    scopus 로고
    • Thermal stress in an adhesively bonded joint with a low modulus adhesive layer at the ends
    • E. Suhir: Thermal stress in an adhesively bonded joint with a low modulus adhesive layer at the ends. J. Appl. Phys. 93, 3657 (2003).
    • (2003) J. Appl. Phys. , vol.93 , pp. 3657
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  • 11
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    • Analysis of interfacial thermal stresses in a tri-material assembly
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    • Reactor design considerations in the hot filament/direct current plasma synthesis of carbon nanofibers
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.