A model study of thermal stress-induced voiding in electronic packages

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 4, 1996, Pages 229-234

  Huang, Y ^a   Hu, K X ^b   Yeh, C P ^b   Li, N Y ^c   Hwang, K C ^d  

^a Michigan Technological University   (United States)

^b Corporate Software Center ^*  (United States)

^c ALCOA TECHNICAL CENTER   (United States)

^d TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUITS; MECHANICAL PROPERTIES; METALLIZING; NUCLEATION; NUMERICAL ANALYSIS; THIN FILMS;

MICROMECHANICS; THIN FILM METALLIZATIONS;

ELECTRONICS PACKAGING;

EID: 0030392198     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792157     Document Type: Article

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