Effective material properties and thermal stress analysis of epoxy molding compound in electronic packaging

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 4, 1998, Pages 413-421

  Shin, Dong Kil ^a   Lee, Jung Ju ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Coefficient of thermal expansion; Effective material property; Elastic modulus; Epoxy molding compound; Finite element analysis; Thermal stresses

Indexed keywords

ELASTIC MODULI; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); SHEET MOLDING COMPOUNDS; STRESS ANALYSIS; STRESS CONCENTRATION; THERMAL EXPANSION; THERMAL STRESS;

SHAPERY EQUATION;

ELECTRONICS PACKAGING;

EID: 0032206168     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.730426     Document Type: Article

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