Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von-Kármán's equations with consideration of thermoelastic strains

International Journal of Solids and Structures

Volumn 34, Issue 23, 1997, Pages 2991-3019

  Suhir, E ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MOISTURE; PLASTIC PRODUCTS; STRAIN; STRESS ANALYSIS; THERMOELASTICITY;

MOISTURE-INDUCED FAILURE; PLASTIC PACKAGES; THERMOELASTIC STRAINS; VON-MISES STRESS;

FAILURE (MECHANICAL);

EID: 0031211389     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0020-7683(96)00207-7     Document Type: Article

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