Predicted thermal mismatch stresses in a cylindrical bi-material assembly adhesively bonded at its ends

Journal of Applied Mechanics, Transactions ASME

Volumn 64, Issue 1, 1997, Pages 15-22

  Suhir, E ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; CYLINDERS (SHAPES); MATHEMATICAL MODELS; SHEAR STRESS; STRENGTH OF MATERIALS; THERMAL EXPANSION; THERMAL STRESS; VIBRATIONS (MECHANICAL);

CYLINDRICAL BIMATERIAL ASSEMBLY;

COMPOSITE MATERIALS;

EID: 0031100993     PISSN: 00218936     EISSN: 15289036     Source Type: Journal    
DOI: 10.1115/1.2787268     Document Type: Article

References (17)

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