Adhesively bonded assemblies with identical nondeformable adherends and 'piecewise continuous' adhesive layer: Predicted thermal stresses in the adhesive

International Journal of Solids and Structures

Volumn 37, Issue 16, 2000, Pages 2229-2252

  Suhir, E ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE AGENT; ADHESIVE WEAR; STRESS; THERMAL;

ADHESIVES; BONDING; ELASTIC MODULI; MATHEMATICAL MODELS; POISSON RATIO; STRAIN; STRESS ANALYSIS; THERMAL EXPANSION; THERMAL STRESS; THERMOELASTICITY;

ADHESIVELY BONDED ASSEMBLIES;

ADHESIVE JOINTS;

EID: 0034711622     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0020-7683(98)00317-5     Document Type: Article

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