Thermal properties of carbon nanotube array used for integrated circuit cooling

Journal of Applied Physics

Volumn 100, Issue 7, 2006, Pages

  Xu, Yuan ^a   Zhang, Yi ^a   Suhir, Ephraim ^a   Wang, Xinwei ^b  

^a Nanoconduction Inc   (United States)

^b UNIVERSITY OF NEBRASKA LINCOLN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT (IC) COOLING; PHOTOTHERMAL METROLOGY; THERMAL CONTACT RESISTANCE; VERTICALLY ALIGNED CNT ARRAYS (VCNTA);

CATALYSTS; COOLING; INTEGRATED CIRCUITS; OPTOELECTRONIC DEVICES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; THERMAL CONDUCTIVITY; THERMODYNAMIC PROPERTIES;

CARBON NANOTUBES;

EID: 33749987760     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2337254     Document Type: Article

References (32)

1. S. Iijima and T. Ichihashi, Nature (London) 363, 603 (1993).
2. M. S. Dresselhaus, G. Dresselhaus, and Ph. Avouris, Carbon Nanotubes, Synthesis, Structure, Properties, and Applications (Springer, New York, 2000).
3. R. H. Baughman, A. A. Zakhidov, and W. A. de Heer, Science 297, 787 (2002).
4. E. W. Wong, P. E. Sheehan, and C. M. Lieber, Science 277, 1971 (1997).
5. M. F. Yu, B. S. Files, S. Arepalli, and R. S. Ruoff, Phys. Rev. Lett. 84, 5552 (2000).
6. T. W. Odom, J. L. Huang, P. Kim, and C. M. Lieber, Nature (London) 391, 62 (1998).
7. J. W. G. Wilder, L. C. Venema, A. G. Rinzler, R. E. Smalley, and C. Dekker, Nature (London) 391, 59 (1998).
8. J. Li, Q. Ye, A. Cassell, H. T. Ng, R. Stevens, J. Han, and M. Meyyappan, Appl. Phys. Lett. 82, 2491 (2003).
9. R. H. Baughmab, Science 284, 1340 (1999).
10. A. Star, Y. Lu, K. Bradley, and G. Gruner, Nano Lett. 4, 1587 (2004).
11. S. J. Tan, A. R. M. Verschueren, and C. Dekker, Nature (London) 393, 49 (1998).
12. P. C. Collins, M. S. Arnold, and P. Avouris, Science 292, 706 (2001).
13. A. Bachtold, P. Hadley, T. Nakanishi, and C. Dekker, Science 294, 1317 (2001).
14. J. Koehne, H. Chen, J. Li, A. Cassell, Q. Ye, H. T. Ng, J. Han, and M. Meyyappan, Nanotechnology 14, 1239 (2003).
15. J. Kong, N. R. Franklin, C. Zhou, M. G. Chapline, S. Peng, K. Cho, and H. Dai, Science 287, 622 (2000).
16. J. Li, Y. Lu, Q. Ye, M. Cinke, J. Han, and M. Meyyapan, Nano Lett. 3, 929 (2003).
17. J. P. Novak, E. S. Snow, E. J. Houser, D. Park, J. L. Stepnowski, and R. A. Mcgill, Appl. Phys. Lett. 83, 4026 (2003).
18. R. S. Ruoff and D. C. Lorents, Carbon 33, 925 (1995).
19. S. Berber, Y. Kwon, and D. Tománek, Phys. Rev. Lett. 84, 4613 (2000).
20. S. Maruyama, Microscale Thermophys. Eng. 7, 41 (2003).
21. M. A. Osman and D. Srivastava, Nanotechnology 12, 21 (2001).
22. J. Che, T. agin, and W. A. Goddard III, Nanotechnology 11, 65 (2000).
23. P. Kim, L. Shi, A. Majumdar, and P. L. McEuen, Phys. Rev. Lett. 87, 215502 (2001).
24. J. Hone, B. Batlogg, Z. Benes, A. T. Johnson, and J. E. Fischer, Science 289, 1730 (2000).
25. L. Shi, D. Li, C. Yu, W. Jang, D. Kim, Z. Yao, P. Kim, and A. Majumdar, J. Heat Transfer 125, 881 (2003).
26. D. J. Yang, Phys. Rev. B 66, 165440 (2002).
27. W. Yi, L. Lu, Z. Dian-lin, Z. W. Pan, and S. S. Xie, Phys. Rev. B 59, R9015 (1999).
28. S. Xie, W. Li, Z. Pan, B. Chang, and L. Sun, J. Phys. Chem. Solids 61, 1153 (2000).
29. L. Lu, W. Yi, and D. L. Zhang, Rev. Sci. Instrum. 72, 2996 (2001).
30. X. W. Wang, Z. Zhong, and J. Xu, J. Appl. Phys. 97, 064302 (2005).
31. X. W. Wang, H. Hu, and X. Xu, J. Heat Transfer 123, 138 (2001).
32. H. Hu, X. W. Wang, and X. Xu, J. Appl. Phys. 86, 3953 (1999).