Qualification approaches and thermal cycle test results for CSP/BGA/FCBGA

Microelectronics Reliability

Volumn 43, Issue 5, 2003, Pages 695-706

  Ghaffarian, Reza ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT TESTING; FLIP CHIP DEVICES; RISK ASSESSMENT; SCANNING ELECTRON MICROSCOPY; SPACE FLIGHT; SPECIFICATIONS; THERMAL CYCLING;

CYCLES-TO-FAILURES (CTF) TESTS;

MICROELECTRONICS;

EID: 0037651069     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00053-2     Document Type: Article

References (14)

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