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Volumn 17, Issue 18, 1998, Pages 1588-1606
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Adhesively bonded assemblies with identical nondeformable adherends and nonhomogeneous adhesive layer: Predicted thermal stresses in the adhesive
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Author keywords
[No Author keywords available]
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Indexed keywords
ELASTIC MODULI;
MATHEMATICAL MODELS;
POISSON RATIO;
STRESS ANALYSIS;
THERMAL EXPANSION;
THERMAL STRESS;
THERMOELASTICITY;
ADHESIVELY BONDED ASSEMBLIES;
NONDEFORMABLE ADHERENDS;
NONHOMOGENEOUS ADHESIVE LAYERS;
PLASTIC ADHESIVES;
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EID: 0032306895
PISSN: 07316844
EISSN: None
Source Type: Journal
DOI: 10.1177/073168449801701801 Document Type: Article |
Times cited : (25)
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References (11)
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