Finite element analysis on soldered joint reliability of QFP device with different solders

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 28, Issue 10, 2007, Pages

  Zhang, Liang ^a   Xue, Songbai ^a   Lu, Fangyan ^a   Han, Zongjie ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Finite element method; Micro devices; Reliability; Stress diagrams

Indexed keywords

FINITE ELEMENT METHOD; RELIABILITY; SOLDERING ALLOYS;

FINITE ELEMENT ANALYSIS; MICRO-DEVICES; QFP DEVICE; STRESS DIAGRAMS;

SOLDERED JOINTS;

EID: 36549024451     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)