Reliability of SnAgCu interconnections with minor additions of Ni or Bi under mechanical shock loading at different temperatures

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 381-390

  Mattila, T T ^a   Kaloinen, E ^a   Syed, A ^b   Kivilahti, J K ^a  

^a AALTO UNIVERSITY   (Finland)

^b AMKOR TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BISMUTH; HEAT LOSSES; PROTECTIVE COATINGS; RELIABILITY THEORY; SHOCK TESTING; SOLDERING; STATISTICAL METHODS; THERMAL EFFECTS;

DROP TEST; INTERCONNECTION COMPOSITIONS; MECHANICAL SHOCK LOADING;

NICKEL;

EID: 35348829770     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373826     Document Type: Conference Paper

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