Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings

Microelectronics Reliability

Volumn 48, Issue 4, 2008, Pages 631-637

  Lee, Young Woo ^a   Lee, Ki Ju ^a   Zhou, Y Norman ^b   Jung, Jae Pil ^a  

^a University of Seoul   (South Korea)

^b UNIVERSITY OF WATERLOO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS; LEAD; POLYCHLORINATED BIPHENYLS; RELIABILITY ANALYSIS; THERMAL SHOCK; TIN ALLOYS;

CRACK RESISTANCE; PULL STRENGTH;

SOLDERED JOINTS;

EID: 42649121020     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.10.005     Document Type: Article

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