Properties of Quad Flat Package Joints Using Sn-Zn-Bi Solder with Varying Lead-Plating Materials

Journal of Electronic Materials

Volumn 32, Issue 12, 2003, Pages 1540-1546

  Iwanishi, H ^a   Hirose, A ^a   Imamura, T ^a   Tateyama, K ^b   Mori, I ^b   Kobayashi, K F ^a  

^a OSAKA UNIVERSITY   (Japan)

^b TOSHIBA CORPORATION   (Japan)

Author keywords

Interfacial reaction; Lead plating; Quad flat package (QFP); Reliability; Sn Zn Bi solder

Indexed keywords

BISMUTH; DISSOLUTION; INTERFACES (MATERIALS); LEAD; PLATING; RELIABILITY; SILVER; SOLDERING ALLOYS; TIN; ZINC;

INTERFACIAL REACTION; QFP; QUAD FLAT PACKAGE; SN-ZN-BI SOLDER;

ELECTRONICS PACKAGING;

EID: 0942299490     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0127-x     Document Type: Conference Paper

References (4)

1. K. Suganuma, MRS Bulletin 26, 880 (2001).
2. K. Suganuma, J. Mater. Res. 15, 884 (2000).
3. A. Hirose, T. Fujii, T. Imamura, and K.F. Kobayashi, Mater. Trans. 42, 794 (2001).
4. T. Imamura, T. Fujii, A. Hirose, and K.F. Kobayashi, Symp. on Microjoining and Assembly Technology in Electronics Proc. (Yokohama, Japan: Jpn. Weld. Soc., 2001), pp. 481-486.