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Volumn 44, Issue 3, 2004, Pages 485-494

The effect of solder paste composition on the reliability of SnAgCu joints

Author keywords

[No Author keywords available]

Indexed keywords

EUTECTICS; FRACTURE; HEAT TRANSFER; MELTING; MICROELECTRONICS; MICROSTRUCTURE; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; THERMAL CYCLING;

EID: 1142263920     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2003.08.004     Document Type: Article
Times cited : (52)

References (19)
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  • 5
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    • A high-performance lead-free solder - The effects of in on 99.3Sn/0.7Cu
    • Hwang J.S., Guo Z., Koenigsmann H. A high-performance lead-free solder - the effects of In on 99.3Sn/0.7Cu. Solder. Surf. Mount Technol. 13(2):2001;7-13.
    • (2001) Solder. Surf. Mount Technol. , vol.13 , Issue.2 , pp. 7-13
    • Hwang, J.S.1    Guo, Z.2    Koenigsmann, H.3
  • 6
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    • Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders
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    • (2001) Solder. Surf. Mount Technol. , vol.13 , Issue.3 , pp. 16-20
    • Ye, L.1    Lai, Z.H.2    Liu, J.3    Thölén, A.4
  • 9
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    • Schubert A, Walter H, Dudek R, Michel B. Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders. In: Proc Int Symp Adv Pack Mater, 2001. p. 129-34.
    • (2001) Proc Int Symp Adv Pack Mater , pp. 129-134
    • Schubert, A.1    Walter, H.2    Dudek, R.3    Michel, B.4
  • 11
    • 0032207630 scopus 로고    scopus 로고
    • Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and in) solder alloys
    • Kariya Y., Otsuka M. Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys. J. Electron. Mater. 27(11):1998;1229-1235.
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  • 12
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    • Zhang F, Chum CC, Li M. Effect of Au on interfacial reactions of eutectic SnPb and SnAgCu solders with Al/Ni(V)/Cu thin film metallization. In: IEEE Proc 52nd Electron Compon Technol Conf, San Diego, 2002. p. 726-31.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.