Effect of 0.10% Ce on intermetallic compounds at Sn-0.7Cu-0.5Ni/Cu interface

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 17, Issue 3, 2007, Pages 390-395

  Lu, Bin ^a   Wang, Juan Hui ^a   Li, Hui ^a   Zhu, Hua Wei ^a   Jiao, Xian He ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Growth rate; IMC; Interfacial reaction; Isothermal aging; Lead free solder

Indexed keywords

GROWTH RATE; SOLDERING ALLOYS; SURFACE CHEMISTRY;

INTERFACIAL REACTION; INTERMETALLIC COMPOUND (IMC); ISOTHERMAL AGING; LEAD FREE SOLDER;

INTERMETALLICS;

EID: 34248671686     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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