Effects of micro-amount of cerium on microstructures of Sn-Ag-Cu solder and soldered joint

Journal of Rare Earths

Volumn 24, Issue SUPPL. 3, 2006, Pages 228-232

  Han, Zongjie ^a   Xue, Songbai ^a   Liu, Lin ^a   Wang, Jianxin ^a   Wu, Yuxiu ^a   Huang, Xiang ^a   Wang, Hui ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Ce; Lead free solder; Microstructure; Rare earths; Sn Ag Cu

Indexed keywords

CERIUM; COPPER ALLOYS; MICROSTRUCTURE; RARE EARTH ADDITIONS; SILVER ALLOYS; SOLDERED JOINTS; TIN ALLOYS; X RAY DIFFRACTION ANALYSIS;

LEAD-FREE SOLDER; SOLDER ALLOY;

SOLDERING ALLOYS;

EID: 34147219710     PISSN: 10020721     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1002-0721(07)60367-6     Document Type: Article

References (14)

1. Zenin V V, Belyaev V N, Segal Y E, et al. Lead-free solders in IC manufacture: a review [J]. Russian Microelectronics, 2003, 32(4): 247.
2. Abtew M, Selvaduray G. Lead-free solders in microelectronics [J]. Materials Science and Engineering: R, 2000, 27(5): 95.
3. Wu C M L, Yu D Q, Law C M T, et al. Properties of lead-free solder alloys with rare earth element additions [J]. Materials Science and Engineering: R, 2004, 44(1): 1.
4. Hirose A, Yanagawa H, Ide E, et al. Joint strength and interfacial microstructure between Sn-Ag-Cu and Sn-Zn-Bi solders and Cu substrate [J]. Science and Technology of Advanced Materials, 2004, 5(2): 267.
5. Xue Songbai, Yu Shenglin, Wang Xuyan, et al. Effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder [J]. Transactions of Nonferrous Metals Society of China (in Chin.), 2005, 15(6): 1285.
6. Xu Guangxian. Rare Earth [M]. 2nd ed. Beijing: Metallurgical Industry Press (in Chin.), 1995.
7. Kang Fuwei, Wang Liping, Zhang Xianyou, et al. Effects of rare earth elements on grain size of industrial pure aluminum [J]. Journal of Harbin University of Science and Technology (in Chin.), 2001, 6(6): 63.
8. Li Dezhi, Liu Changqing, Conway P P. Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects [J]. Materials Science and Engineering: A, 2005, 391(1): 95.
9. Sharif A, Chan Y C. Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles [J]. Journal of Materials Science: Materials in Electronics, 2005, 16(3): 153.
10. Moon K W, Boettinger W J, Katter U R, et al. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys [J]. Journal of Electronic Materials, 2000, 29(10): 1122.
11. Askeland D R, Phule P P. The Science and Engineering of Materials (Reprint edition) [M]. Beijing: Tsinghua University Press (in Chin.), 2005. 153.
12. Zhu Ying. Failure mechanism of SMT Sn-Pb-RE solder joint during thermal cycling [D]. Harbin: Harbin Institute of Technology Dissertation for the Doctor's Degree (in Chin.), 1996.
13. Xue Songbai, Chen Yan, Lu Xiaochun. Thermodynamic calculation and evaluation for Sn-Ag-Cu-Ce lead-free solder alloy system [J]. Transactions of the China Welding Institution, 2005, 26(5): 20.
14. Xue Songbai, Ma Xin, Qian Yiyu. Thermodynamic assessment of interaction relation between lanthanum and constituent elements in Sn-Pb alloy [J]. Journal of Rare Earths, 2001, 19(2): 107.