Simulation on equivalent stress in soldered joints of QFP devices with different leads

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 28, Issue 6, 2007, Pages 17-20

  Xue, Songbai ^a   Wu, Yuxiu ^a   Han, Zongjie ^a   Huang, Xiang ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Equivalent stress; Finite element method; Life prediction; Quad flat package

Indexed keywords

EQUIVALENT STRESS; LIFE PREDICTION; NUMERICAL SIMULATION; QUAD FLAT PACKAGE;

COMPUTER SIMULATION; FINITE ELEMENT METHOD; RESIDUAL STRESSES; TENSILE STRENGTH; TENSILE TESTING; THERMAL CYCLING;

SOLDERED JOINTS;

EID: 34447334524     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)