Microstructure and melting property of Sn-2.5Ag-0.7Cu-XGe solder

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 28, Issue 10, 2007, Pages 65-68

  Meng, Gongge ^a   Yang, Tuoyu ^b   Chen, Leida ^a  

^a HARBIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b ANHUI SCIENCE AND TECHNOLOGY UNIVERSITY   (China)

Author keywords

Lead free solder; Melting property; Microstructure

Indexed keywords

CHEMICAL ANALYSIS; COPPER ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; INTERMETALLICS; MELTING POINT; METALLOGRAPHIC MICROSTRUCTURE; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; TIN ALLOYS;

INTERMETALLIC COMPOUNDS; LEAD FREE SOLDER; MELTING PROPERTY; MELTING TEMPERATURE;

SOLDERING ALLOYS;

EID: 36549063761     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)