The effects of minor Fe, Co, and Ni additions to lead-free solders on the thickness of Cu3Sn at the interface

Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

Volumn , Issue , 2007, Pages 280-283

  Wang, Y W ^a   Kao, C R ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Cu3Sn; Kirkendall void; Lead free solders; Minor elements

Indexed keywords

BRAZING; COPPER; COPPER ALLOYS; MICROELECTRONICS; MICROSYSTEMS; NICKEL; SOLDERING ALLOYS; TECHNOLOGY; TIN; TITANIUM COMPOUNDS; WELDING;

CU3SN; KIRKENDALL VOID; KIRKENDALL VOIDS; LEAD-FREE SOLDER; LEAD-FREE SOLDERING; LEAD-FREE SOLDERS; MICROELECTRONICS INDUSTRY; MINOR ELEMENTS; RELIABILITY CHALLENGES;

LEAD;

EID: 48649091025     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2007.4433617     Document Type: Conference Paper

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