Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 16, Issue SUPPL., 2006, Pages

  Li, Guo Yuan ^a   Shi, Xun Qing ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INTEL CORPORATION   (China)

Author keywords

Bismuth; Interconnects; Intermetallics; Pb free solder; Sn Ag Cu alloy; Solder joint

Indexed keywords

ACTIVATION ENERGY; BISMUTH; COPPER ALLOYS; EFFECTS; ENERGY DISPERSIVE SPECTROSCOPY; MICROSTRUCTURE; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SOLDERED JOINTS; TIN ALLOYS; X RAY DIFFRACTION ANALYSIS; DIFFRACTOMETERS; GROWTH KINETICS; INTERMETALLICS; MICROSTRUCTURAL EVOLUTION; OPTICAL INTERCONNECTS;

INTERCONNECTS; PB-FREE SOLDER;

INTERMETALLICS; BISMUTH;

ELEMENT DIFFUSION; GRAIN SIZE; INTERCONNECTS; INTERMETALLIC COMPOUND (IMC) FORMATION; INTERMETALLIC LAYERS; OPTICAL MICROSCOPE (OM); PB FREE SOLDER; SNAGCU ALLOY; SOLDER JOINT;

EID: 33746812644     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(06)60292-6     Document Type: Article

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