Microvia filling by copper electroplating using diazine black as a leveler

Electrochimica Acta

Volumn 54, Issue 24, 2009, Pages 5894-5901

  Dow, Wei Ping ^a   Li, Chih Chan ^a   Su, Yong Chih ^b   Shen, Shao Ping ^a   Huang, Chen Chia ^b   Lee, Cliff ^c   Hsu, Bob ^c   Hsu, Shar ^c  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^c OMG (Asia) Electronic Chemicals Co Ltd   (Taiwan)

Author keywords

Copper electroplating; Leveler; Microvia filling

Indexed keywords

CHEMICAL ACTIVITIES; COPPER ELECTROPLATING; COPPER FILMS; CRYSTALLINE ORIENTATIONS; ELECTROCHEMICAL ANALYSIS; ELECTROCHEMICAL BEHAVIORS; ELECTRONIC PRODUCT; ETCHING RATE; GALVANOSTATIC MEASUREMENT; JANUS GREEN B; LEVELER; METALLIZATION; MICROVIA FILLING; ORGANIC ADDITIVES; SCANNING ELECTRON MICROSCOPES; SUBMICRON; SURFACE ATOMS;

ADDITIVES; COPPER PLATING; ELECTRONICS INDUSTRY; ELECTROPLATING; FILLING; METALLIC FILMS; PHOTORESISTS; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION;

COPPER;

EID: 67649197273     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2009.05.053     Document Type: Article

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