Filling mechanism in microvia metallization by copper electroplating

Electrochimica Acta

Volumn 53, Issue 28, 2008, Pages 8228-8237

  Dow, Wei Ping ^a   Yen, Ming Yao ^a   Liao, Sian Zong ^a   Chiu, Yong Da ^a   Huang, Hsiao Chun ^b  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Convection dependent adsorption; Copper electroplating; Filling mechanism; Microvia

Indexed keywords

ELECTROCHEMISTRY; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTROPLATING; MACHINE DESIGN; MECHANISMS; METALLIZING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS;

BOTTOM-UP FILLING; CONVECTION-DEPENDENT ADSORPTION; COPPER ELECTROPLATING; COPPER LAYERS; FILLING MECHANISM; METALLIZATION; MICROVIA; MICROVIA FILLING; MICROVIAS; PATTERN DESIGNS; PRINTED CIRCUIT BOARD (PCB);

COPPER;

EID: 50649087255     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2008.06.042     Document Type: Article

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