Copper damascene electrodeposition and additives

Journal of Electroanalytical Chemistry

Volumn 559, Issue , 2003, Pages 137-142

  Kondo, K ^a   Yamakawa, N ^a   Tanaka, Z ^a   Hayashi, K ^a  

^a OKAYAMA UNIVERSITY   (Japan)

Author keywords

Additives; Copper; Damascene; Electrodeposition; Via filling

Indexed keywords

ASPECT RATIO; ELECTRODEPOSITION; ELECTROLYSIS; POLYETHYLENE GLYCOLS; ROTATING DISKS; SEMICONDUCTOR MATERIALS; SILICON WAFERS;

COPPER DAMASCENE ELECTRODEPOSITION;

COPPER;

EID: 0242489287     PISSN: 15726657     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-0728(03)00110-4     Document Type: Conference Paper

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