Practical monitoring of filling performance in a copper plating bath

Electrochemical and Solid-State Letters

Volumn 9, Issue 8, 2006, Pages

  Dow, Wei Ping ^a,c   Yen, Ming Yao ^a   Chou, Cheng Wei ^a   Liu, Cheng Wei ^a   Yang, Wei Hsiu ^b   Chen, Chih Hui ^b  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b Research and Development Division ^*  (Taiwan)

^c ELECTROCHEMICAL SOCIETY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

GALVANOSTAT MEASUREMENT; LINEAR FUNCTION; MICROVIA; PILOT PLATING BATH;

GALVANIZING; METALLIZING; POLARIZATION; SOLUTIONS; SURFACE PHENOMENA;

COPPER PLATING;

EID: 33745411223     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2205047     Document Type: Article

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