Role of chloride ions in suppression of copper electrodeposition by polyethylene glycol

Journal of the Electrochemical Society

Volumn 152, Issue 5, 2005, Pages

  Hebert, Kurt R ^a  

^a Iowa State University of Science and Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ADSORPTION; BINDING ENERGY; COPPER; MATHEMATICAL MODELS; NEGATIVE IONS; POLYETHYLENE GLYCOLS; SENSITIVITY ANALYSIS;

ACTIVE DEPOSITION; BINDING SITES; POLYMER SURFACES; SURFACE COVERAGE;

ELECTRODEPOSITION;

EID: 20344401060     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1878372     Document Type: Article

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