Mechanical and structural properties of electrodeposited copper and their relation with the electrodeposition parameters

Surface and Coatings Technology

Volumn 191, Issue 1, 2005, Pages 7-16

  Ibañez, Ana ^a   Fatas E ^a  

^a UNIVERSIDAD AUTÓNOMA DE MADRID   (Spain)

Author keywords

Copper; Electroplating; Microhardness

Indexed keywords

CRYSTAL ORIENTATION; CURRENT DENSITY; ELASTIC MODULI; ELECTRODEPOSITION; GRAIN SIZE AND SHAPE; INDENTATION; MECHANICAL PROPERTIES; MICROHARDNESS; PLASTICITY; SCANNING ELECTRON MICROSCOPY; STRUCTURE (COMPOSITION); WAVEFORM ANALYSIS; X RAY DIFFRACTION ANALYSIS;

ELASTIC RECOVERY; PLASTIC COMPONENT; SQUARE WAVE PULSES;

COPPER PLATING;

ELECTRODEPOSITION;

EID: 10344261552     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2004.05.001     Document Type: Article

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