Voltammetric study of the inhibition effect of polyethylene glycol and chloride ions on copper deposition

Journal of the Electrochemical Society

Volumn 155, Issue 4, 2008, Pages

  Huerta Garrido, M E ^a,b   Pritzker, M D ^a,b  

^a UNIVERSITY OF WATERLOO   (Canada)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; CHLORINE; COPPER; HYSTERESIS; NEGATIVE IONS; POLYETHYLENE GLYCOLS; SUBSTRATES;

CHLORIDE IONS; COPPER DEPOSITION; FILM FORMATION;

ELECTRODEPOSITION;

EID: 40549086662     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2837874     Document Type: Article

References (40)

1. J. J. Kelly, C. Tian, and A. C. West, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1391968, 146, 2540 (1999).
2. T. P. Moffat, J. E. Bonevich, W. H. Huber, A. Stanishevsky, D. R. Kelly, G. R. Stafford, and D. Josell, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1394096, 147, 4524 (2000).
3. P. Taephaisitphongse, Y. Cao, and A. C. West, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1376636, 148, C492 (2001).
4. K. Kondo, N. Yamakawa, Z. Tanaka, and K. Hayashi, J. Electroanal. Chem. JECHES 0022-0728 10.1016/S0022-0728(03)00110-4, 559, 137 (2003).
5. W.-C. Tsai, C.-C. Wan, and Y.-Y. Wang, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1560942, 150, C267 (2003).
6. R. Akolkar and U. Landau, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1799431, 151, C702 (2004).
7. K. Kondo, T. Matsumoto, and K. Watanabe, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1649235, 151, C250 (2004).
8. T. P. Moffat, D. Wheeler, and D. Josell, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1651530, 151, C262 (2004).
9. W.-P. Dow and H.-S. Huang, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1849934, 152, C67 (2005).
10. W.-P. Dow, H.-S. Huang, M.-Y. Yen, and H.-C. Huang, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1901670, 152, C425 (2005).
11. W.-P. Dow, M.-Y. Yen, W.-B. Lin, and S.-W. Ho, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2052019, 152, C769 (2005).
12. T. P. Moffat, D. Wheeler, M. D. Edelstein, and D. Josell, IBM J. Res. Dev. IBMJAE 0018-8646, 49, 19 (2005).
13. B.-H. Wu, C.-C. Wan, and Y.-Y. Wang, J. Appl. Electrochem. JAELBJ 0021-891X 10.1023/A:1025550725883, 33, 823 (2003).
14. M. Yokoi, S. Konishi, and T. Hayashi, Denki Kagaku oyobi Kogyo Butsuri Kagaku DKOKAZ 0366-9297, 52, 218 (1984).
15. J. P. Healy, D. Pletcher, and M. Goodenough, J. Electroanal. Chem. JECHES 0022-0728 10.1016/0022-0728(92)80420-9, 338, 155 (1992).
16. M. Petri, D. M. Kolb, U. Memmert, and H. Meyer, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1814451, 151, C793 (2004).
17. C. Gabrielli, P. Mo̧ot́guy, H. Perrot, D. Nieto-Sanz, and Z. Zdunek, Electrochim. Acta ELCAAV 0013-4686 10.1016/j.electacta.2005.02.127, 51, 1462 (2006).
18. L. D. Burke, A. M. O'Connell, R. Sharna, and C. A. Buckley, J. Appl. Electrochem. JAELBJ 0021-891X 10.1007/s10800-006-9150-y, 36, 919 (2006).
19. L. Bonou, M. Eyraud, R. Denoyel, and Y. Massiani, Electrochim. Acta ELCAAV 0013-4686 10.1016/S0013-4686(02)00356-0, 47, 4139 (2002).
20. J. D. Reid and A. P. David, Plat. Surf. Finish. PSFMDH 0360-3164, 74, 66 (1987).
21. D. Stoychev and C. Tsvetanov, J. Appl. Electrochem. JAELBJ 0021-891X 10.1007/BF00241515, 26, 741 (1996).
22. J. J. Kelly and A. C. West, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1838829, 145, 3472 (1998).
23. N. Tantavichet and M. D. Pritzker, Electrochim. Acta ELCAAV 0013-4686 10.1016/j.electacta.2004.08.045, 50, 1849 (2005).
24. Z. V. Feng, X. Li, and A. A. Gewirth, J. Phys. Chem. B JPCBFK 1089-5647 10.1021/jp034875m, 107, 9415 (2003).
25. M. Eyraud, S. Kologo, L. Bonou, and Y. Massiani, J. Electroceram. JOELFJ 1385-3449 10.1007/s10832-006-2402-8, 16, 55 (2006).
26. M. L. Walker, L. J. Richter, and T. P. Moffat, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1915271, 152, C403 (2005).
27. D. S. Stoychev, I. Vitanova, S. Rashkov, and T. Vitanov, Surf. Technol. SUTED8 0376-4583 10.1016/0376-4583(78)90020-1, 7, 427 (1978).
28. M. Hayase, M. Taketani, K. Aizawa, T. Hatsuzawa, and K. Hayabusa, Electrochem. Solid-State Lett. ESLEF6 1099-0062 10.1149/1.1507942, 5, C98 (2002).
29. T. Pearson and J. K. Dennis, J. Appl. Electrochem. JAELBJ 0021-891X 10.1007/BF01033595, 20, 196 (1990).
30. M. R. H. Hill and G. T. Rogers, J. Electroanal. Chem. Interfacial Electrochem. JEIEBC 0022-0728 10.1016/0368-1874(78)87015-4, 86, 179 (1978).
31. J. G. Long, P. C. Searson, and P. M. Vereecken, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2168050, 153, C258 (2006).
32. V. D. Jović and B. M. Jović, J. Serb. Chem. Soc. JSCSEN 0352-5139, 66, 935 (2001).
33. M. J. Willey and A. C. West, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2335587, 153, C728 (2006).
34. B. Bozzini, L. D'Urzo, C. Mele, and V. Romanello, J. Mater. Sci. JMTSAS 0022-2461 10.1007/BF00540392, 17, 915 (2006).
35. R. Ding, X. Zhang, J. W. Evans, and F. M. Doyle, ECS Trans. ECSTF8 10.1149/1.2196017, 2 (3), 281 (2006).
36. P. M. Vereecken, R. A. Binstead, H. Deligianni, and P. C. Andricacos, IBM J. Res. Dev. IBMJAE 0018-8646, 49, 3 (2005).
37. K. Doblhofer, S. Wasle, D. M. Soares, K. G. Weil, and G. Ertl, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1602083, 150, C657 (2003).
38. Z. Nagy, J. P. Blaudeau, N. C. Hung, L. A. Curtiss, and D. J. Zurawski, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.2044254, 142, L87 (1995).
39. K. R. Hebert, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1878372, 152, C283 (2005).
40. M. Kang and A. A. Gewirth, J. Electrochem. Soc. JESOAN 0013-4651 10.1149/1.1572152, 150, C426 (2003).