Electrodeposition of Cu from acidic sulfate solutions in the presence of bis-(3-sulfopropyl)-disulfide (SPS) and chloride ions

Journal of the Electrochemical Society

Volumn 153, Issue 4, 2006, Pages

  Bozzini, B ^a,b   D'Urzo, L ^a   Romanello, V ^a   Mele, C ^a  

^a UNIVERSITY OF SALENTO   (Italy)

^b ELECTROCHEMICAL SOCIETY   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ACIDIC SOLUTIONS; BIS-(3-SULFOPROPYL)-DISULFIDE; CATHODIC POTENTIAL; POTENTIAL WINDOW;

CATHODES; ELECTRODEPOSITION; ELECTROPLATING; IN SITU PROCESSING; RAMAN SCATTERING; SOLUTIONS;

COPPER;

EID: 33644799459     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2172555     Document Type: Article

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