A study of component-level measure of board-level drop impact reliability by ball impact test

2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008

Volumn , Issue , 2008, Pages 57-62

  Lail, Yi Shao ^a   Wong, E H ^b   Rajoo, R ^c   Seah, S K W ^b   Selvanayagam, C S ^c   Van Driel, W D ^d   Caers, J F J M ^e   Zhao, X J ^e   Owens, N ^f   Tan, L C ^f   Leoni, M ^f   Eu, P L ^f  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^c INSTITUTE OF MICROELECTRONICS   (Singapore)

^d NXP SEMICONDUCTORS   (Netherlands)

^e PHILIPS RESEARCH LABORATORIES   (Netherlands)

^f FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DROP IMPACTS; ELECTRONIC PRODUCTS; ENERGY PARAMETERS; ENERGY TO PEAKS; IMPACT TESTS; MATERIAL COMBINATIONS; PEAK LOADS; QUANTITATIVE CORRELATIONS; SENSITIVITY COEFFICIENTS; SOLDER ALLOYS; SOLDER JOINTS; STRONG CORRELATIONS; TEST METHODOLOGIES; TEST METHODS; TEST RESULTS;

BRAZING; DROPS; ELECTRONICS INDUSTRY; FAILURE ANALYSIS; FRACTURE ENERGY; IMPACT RESISTANCE; MICROSYSTEMS; NATURAL FREQUENCIES; QUALITY ASSURANCE; RELIABILITY ANALYSIS; STRAIN RATE; TESTING; TOTAL QUALITY MANAGEMENT; WELDING;

FRACTURE;

EID: 64049106512     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2008.4783807     Document Type: Conference Paper

References (26)

1. JEDEC Solid State Technology Association. JESD22-B111: Board Level Drop Test Method of Component for Handheld Electronics Products, 2003.
2. J. Varghese and A. Dasgupta, "Test methodology for impact testing of portable electronic products," Proc. 2003 ASME Int. Mech. Eng. Congr. Exhibit., Washington, D.C., USA, IMECE2003-41844, 2003.
3. th Electr. Comp. Technol. Conf, Lake Buena Vista, FL, USA, pp. 1519-1525, 2005.
4. K. Nakado, A. Yaguchi, T. Terasaki and K. Yamamoto, "Fatigue strength of BGA type solder joints between package and printed wiring board of portable device", JSME Int. J. A, Vol. 49, No. 2, pp. 220-228, 2006.
5. th Electron. Comp. Technol. Conf, San Diego, CA, USA, pp. 95-101, 2006.
6. th Electron. Comp. Technol. Conf, San Diego, CA, USA, pp. 1003-1008, 2006.
7. th Electron. Comp. Technol. Conf, San Diego, CA, USA, pp. 1628-1633, 2006.
8. th Electron. Comp. Technol. Conf, Reno, NV, USA, pp. 400-406, 2007.
9. th Electr. Comp. Technol. Conf, Las Vegas, NV, USA, pp. 668-674, 2004.
10. M. Date, T. Shoji, M. Fujiyoshi, K. Sato and K. N. Tu, "Ductile-to-brittle transition in Sn-Zn solder joints measured by impact test," Scripta Mater., Vol. 51, pp. 641-645, 2004.
11. th Electr. Comp. Technol. Conf, Lake Buena Vista, FL, USA, pp. 467-471, 2005.
12. th Electr. Comp. Technol. Conf, Lake Buena Vista, FL, USA, pp. 1194-1201, 2005.
13. th Electr. Comp. Technol. Conf, Lake Buena Vista, FL, USA, pp. 1202-1209, 2005.
14. th Electr. Comp. Technol. Conf., San Diego, CA, USA, pp. 64-71, 2006.
15. th Electr. Comp. Technol. Conf., San Diego, CA, USA, pp. 906-917, 2006.
16. A. T. Valota, A. Losavio, L. Renard and A. Vicenzo, "High speed pull test characterization of BGA solder joints," Proc. EuroSimE 2006, Como, Italy, pp. 480-485, 2006.
17. C.-L. Yeh, Y.-S. Lai, H.-C. Chang and T.-H. Chen, "Empirical correlation between package-level ball impact test and board-level drop reliability," Microelectron. Reliab., Vol. 47, No. 7, pp. 1127-1134,2007.
18. Y.-S. Lai, H.-C. Chang and C.-L. Yeh, "Evaluation of solder joint strengths under ball impact test," Microelectron. Reliab., Vol. 47, No. 12, pp. 2179-2187, 2007.
19. th Electr. Comp. Technol. Conf, Reno, NV, USA, pp. 1504-1513,2007.
20. th Electr. Comp. Technol. Conf, Reno, NV, USA, pp. 364-372, 2007.
21. th Electr. Comp. Technol. Conf, Reno, NV, USA, pp. 1522-1529, 2007.
22. Y.-S. Lai, J.-M. Song, H.-C. Chang and Y.-T. Chiu, "Ball impact responses of Ni-or Ge-doped Sn-Ag-Cu solder joints," J. Electron. Mater., Vol. 37, No. 2, pp. 201-209, 2008.
23. Y.-S. Lai, C.-L. Yeh, H.-C. Chang and C.-L. Kao, "Characterizations of ball impact responses of wafer-level chip-scale packages. J. Alloy. Comp., Vol. 450, No. 1-2, pp. 238-244, 2008.
24. JEDEC Solid State Technology Association. JESD22-B117: Solder Ball Shear, 2006.
25. C.-L. Yeh and Y.-S. Lai, "Design guideline for ball impact test apparatus," J. Electron. Packag., Vol. 129, No. 1, pp. 98-104, 2007.
26. E. H. Wong, C. S. Selvanayagam, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, D. R. Frear, M. Leoni, Y.-S. Lai and C.-L. Yeh, "Stress-strain characteristics of tin-based solder alloys at medium strain rate,"Mater. Lett, Vol. 62, No. 17-18, pp. 3031-3034, 2008.