Interface failure in lead free solder joints

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 906-917

  Darveaux, Robert ^a,b   Reichman, Corey ^a,b   Islam, Nokibul ^a  

^a AMKOR TECHNOLOGY   (United States)

^b ARIZONA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACE FAILURE; INTERFACE MICROSTRUCTURE; JOINT STRENGTH; THERMAL AGING;

ARRAYS; DUCTILITY; FAILURE ANALYSIS; INTERFACES (MATERIALS); LEAD; MICROSTRUCTURE; TENSILE TESTING;

SOLDERED JOINTS;

EID: 33845567943     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645763     Document Type: Conference Paper

References (11)

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