Design guideline for ball impact test apparatus

Journal of Electronic Packaging

Volumn 129, Issue 1, 2007, Pages 98-104

  Yeh, Chang Lin ^b   Lai, Yi Shao ^a,b  

^a ASME

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Ball impact test (BIT); Design guideline; Solder joint; Structural dynamics; Transient structural responses

Indexed keywords

BRITTLE FRACTURE; IMPACT TESTING; INTERMETALLICS; RELIABILITY THEORY; SOLDERED JOINTS; STRUCTURAL DYNAMICS;

DESIGN GUIDELINES; FORCE PROFILES; TRANSIENT CHARACTERISTICS; TRANSIENT STRUCTURAL RESPONSES;

ELECTRONICS PACKAGING;

EID: 37249079785     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2429716     Document Type: Article

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