Solder joint reliability of BGA package under end-user handling test conditions

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 400-406

  Pringle, Troy ^a   Raghavan, Prasanna ^a   Malatkar, Pramod ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPONENT LEVEL TESTS; COMPONENT TESTING; CYCLIC BENDS; CYCLIC SHOCKS; LEAD FREE SOLDERS; NUMBER-OF-CYCLES TO FAILURE (N);

FAILURE ANALYSIS; RELIABILITY ANALYSIS; SHOCK TESTING; STRAIN RATE; SYSTEMS ANALYSIS;

SOLDERED JOINTS;

EID: 35348820512     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373828     Document Type: Conference Paper

References (11)

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