Characterizations of ball impact responses of wafer-level chip-scale packages

Journal of Alloys and Compounds

Volumn 450, Issue 1-2, 2008, Pages 238-244

  Lai, Yi Shao ^a   Yeh, Chang Lin ^a   Chang, Hsiao Chuan ^a   Kao, Chin Li ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Ball impact test (BIT); Finite element analysis; Impact force profile; WLCSP

Indexed keywords

FINITE ELEMENT METHOD; IMPACT TESTING; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; THREE DIMENSIONAL; WSI CIRCUITS;

BALL IMPACT TEST (BIT); IMPACT FORCE PROFILE; STRUCTURAL RESPONSES;

CHIP SCALE PACKAGES;

EID: 37449018353     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.10.102     Document Type: Article

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