Stress-strain characteristics of tin-based solder alloys at medium strain rate

Materials Letters

Volumn 62, Issue 17-18, 2008, Pages 3031-3034

  Wong, E H ^a   Selvanayagam, C S ^a   Seah, S K W ^a   van Driel, W D ^b   Caers, J F J M ^b   Zhao, X J ^b   Owens, N ^c   Tan, L C ^c   Frear, D R ^c   Leoni, M ^c   Lai, Y S ^d   Yeh, C L ^d  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

^c FREESCALE SEMICONDUCTOR INC   (United States)

^d ASE Inc   (Taiwan)

Author keywords

Characterization methods; Finite element modelling; Mechanical properties; Strain rate

Indexed keywords

COMPUTER SOFTWARE; FINITE ELEMENT METHOD; PLASTIC FLOW; RELIABILITY ANALYSIS; SOLDERED JOINTS; STRAIN RATE;

CHARACTERIZATION METHODS; DROP IMPACT RELIABILITY; LEAD-FREE SOLDER ALLOYS; SOLDER MATERIALS;

TIN ALLOYS;

EID: 43149092896     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2008.01.101     Document Type: Article

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