Relationship of tensile interfacial strength to lead-free BGA impact performance

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1628-1633

  Lal, Anand ^a   Bradley, Edwin ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACIAL STRENGTH; LEAD FREE ALLOYS; STRENGTH CHARACTERISTICS; SUBSTRATE PAD;

ARRAYS; INTERFACES (MATERIALS); INTERMETALLICS; LEAD; RELIABILITY; SOLDERED JOINTS; SUBSTRATES; TENSILE STRENGTH;

ELECTRONICS PACKAGING;

EID: 33845584522     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645875     Document Type: Conference Paper

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