High speed pull test characterization of BGA solder joints

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Valota, Anna Tiziana ^a   Losavio, Aldo ^a   Renard, Loic ^a   Vicenzo, Antonello ^b  

^a STMICROELECTRONICS   (Italy)

^b POLITECNICO DI MILANO   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

CORRELATION METHODS; DYNAMIC LOADS; ELECTRONIC EQUIPMENT; FRACTURE; PORTABLE EQUIPMENT; RELIABILITY;

DROP IMPACT; LEAD-FREE SOLDER; PULL TEST EQUIPMENT; SHOCK RELIABILITY;

SOLDERED JOINTS;

EID: 33847164127     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1644005     Document Type: Conference Paper

References (9)

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